Evolution in Packaging in LV DC-DC Applications(研讨会视频)

更新时间 2014-12-03

This paper discusses on the advantages of co-packaging two power MOSFET die, along with a gate driver IC die, to form a low-voltage, high-current (60 A) Multi-Chip Module (MCM) synchronous buck power stage. It also provides a brief overview of the low-voltage (< 30 V) MCM evolution, along with a discussion on why further advancements in packaging technologies are required to improve performance.

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中文文档 3_Evolution in Packaging in LV DC-DC Applications pdf 1.0 42.04KB 135
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